Company:
BW&CO is a dynamic consulting firm where expertise meets impact—we help biotech startups and deep-tech companies secure millions in federal funding. Join a team where precision matters, every project is unique, and your expertise helps transform innovative research ideas into funded realities.

Job Summary
We are seeking an experienced Technical Grant Writer with specific expertise in advanced microelectronics, semiconductor packaging, and hardware-driven R&D projects. This role is ideal for a writer who understands both the technical depth of advanced packaging systems — including 2.5D/3D integration, heterogeneous integration, wafer-level packaging, and domestic semiconductor manufacturing — and the strategic requirements of federal R&D funding programs (e.g., DoD OTAs, SBIR/STTR, Army/DEVCOM solicitations).

The ideal candidate has a proven record of winning competitive grants and can translate complex hardware and semiconductor concepts into compelling, compliant, and persuasive proposal narratives.

Key Responsibilities

Grant Proposal Development

• Research, write, and submit high-quality federal R&D grant proposals for advanced microelectronics, semiconductor packaging, and hardware-centric projects
• Develop complete proposal packages aligned with solicitation requirements and evaluation criteria

Technical & Scientific Writing

• Translate complex semiconductor packaging technologies — including silicon interposers, fan-out wafer-level packaging (FO-WLP), 2.5D/3D advanced system integration, through-silicon vias (TSVs), heterogeneous integration, and RF packaging — into clear, compelling narratives
• Articulate technical merit, innovation, feasibility, and commercialization potential

Collaboration & Client Engagement

• Work closely with clients, subject-matter experts, and internal project managers to gather technical inputs
• Ensure technical accuracy, narrative consistency, and strategic alignment across proposal sections

Required Qualifications

Education

• Master's degree required
• PhD strongly preferred (Electrical Engineering, Materials Science, Semiconductor Engineering, or related technical field)

Experience

• 4+ years of professional scientific or technical grant writing experience
• Demonstrated success securing federal funding for hardware, semiconductor, or advanced manufacturing R&D projects

Technical Expertise

• Strong understanding of:
• Advanced semiconductor packaging technologies (2.5D/3D integration, FO-WLP, silicon/glass/SiC interposers, hybrid bonding, high-density interconnects)
• Semiconductor manufacturing processes and supply chain ecosystems
• Federal R&D grant and OTA requirements (e.g., DoD SBIR/STTR, Army CIR/OTA solicitations)

Writing & Research Skills

• Exceptional technical writing and editing abilities
• Proven ability to clearly communicate complex technical concepts to non-technical reviewers
• Skilled at identifying relevant funding opportunities and aligning proposals to agency priorities

Professional Skills

• Excellent communication and collaboration skills
• Strong attention to detail and organizational ability
• Ability to manage multiple proposals, deadlines, and client engagements simultaneously

Preferred Qualifications

• Experience writing grants for advanced packaging, microelectronics, or defense-industrial base programs
• Familiarity with DoD OTA mechanisms, DEVCOM/Army solicitations, and domestic manufacturing resiliency initiatives
• Knowledge of federal funding agencies' review processes and best practices
• Track record of winning large or highly competitive hardware/semiconductor-focused grants

Compensation & Benefits

• Pay: Up to $140,000/year, commensurate with experience and education
• Bonuses: Clear bonus structure for winning grants and participation in internal projects
• Benefits: Flexible schedule, Medical, Vision, and Dental Insurance, 401(k)
• Schedule: Monday–Friday, part-time, project based - we are flexible

Pay: Up to $140,000.00 per year

Benefits:

• 401(k)
• Dental insurance
• Flexible schedule
• Health insurance
• Paid time off
• Referral program
• Vision insurance

Work Location: Remote