This role is responsible for providing advanced technical leadership across semiconductor manufacturing equipment and facility systems supporting both a 3-inch GaAs/InP fab and an 8-inch silicon fab. The Master Equipment Engineer drives tool reliability, facility uptime, process support, and operational excellence across a diverse set of wafer fabrication platforms and supporting utility systems. This position serves as a subject matter expert for equipment performance, facilities integration, problem solving, continuous improvement, and cross-functional execution in a high-mix manufacturing environment.

Key Responsibilities

• Provide senior-level technical ownership for semiconductor manufacturing equipment used in III-V and silicon wafer fabrication, including installation, startup, qualification, sustainment, troubleshooting, and performance optimization.
• Support and improve fab equipment across process areas such as lithography, deposition, etch, wet processing, metrology, and supporting specialty tools as applicable to GaAs, InP, and silicon manufacturing.
• Lead root cause analysis and permanent corrective actions for chronic equipment and utility failures using structured problem-solving methodologies.
• Drive key equipment performance metrics including uptime, availability, MTBF, MTTR, preventive maintenance compliance, and defect or scrap reduction.
• Develop, revise, and standardize maintenance procedures, equipment specifications, spare parts strategies, and troubleshooting documentation.
• Provide technical leadership for fab facilities systems including cleanroom support, HVAC, process cooling water, chilled water, vacuum, compressed dry air, bulk and specialty gases including HPM’s, chemical distribution, ultrapure water, wastewater neutralization, exhaust, and abatement systems.
• Partner with facilities, process, manufacturing, EHS, quality, and suppliers to ensure stable tool operation, robust utility delivery, and safe production support.
• Lead capacity, reliability, and lifecycle improvement projects for both manufacturing tools and facility infrastructure.
• Support new tool installs, equipment transfers, retrofits, facility tie-ins, and expansion activities with a focus on safety, schedule, and operational readiness.
• Analyze equipment and facilities data to identify trends, predict failures, improve preventive maintenance strategies, and enhance overall factory performance.
• Manage technical interactions with OEMs, contractors, and service providers, including scope definition, issue escalation, and acceptance criteria.
• Mentor engineers and technicians elevate troubleshooting capability across the organization, and contribute to technical training and knowledge sharing.
• Ensure compliance with cleanroom practices, lockout/tagout requirements, hazardous chemical safety, and all applicable environmental, health, and safety regulations.

Required Qualifications

• Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related engineering discipline; or bachelor’s degree with a minimum of 10 years of directly relevant semiconductor equipment and/or facilities engineering experience.
• Minimum of 10 years of experience supporting semiconductor fabrication equipment, semiconductor facilities systems, or a combination of both in a manufacturing environment.
• Demonstrated experience in wafer fab operations supporting either III-V technologies such as GaAs and InP, silicon wafer fabrication, or both.
• Strong hands-on troubleshooting experience in complex electromechanical, vacuum, RF, pneumatic, fluid delivery, thermal, and control systems.
• Working knowledge of fab utility systems and infrastructure required to support semiconductor manufacturing equipment.
• Proven ability to lead root cause investigations, implement corrective actions, and improve equipment and system reliability.
• Experience reading and interpreting schematics, P&IDs, electrical drawings, mechanical drawings, and OEM technical documentation.
• Strong project management, communication, and cross-functional collaboration skills.
• Ability to work effectively in a cleanroom manufacturing environment and support off-hours escalation when required.
• Travel requirement: less than 20%.

Preferred Qualifications

• Experience supporting mixed fab environments with both compound semiconductor and silicon manufacturing technologies.
• Knowledge of III-V semiconductor process challenges and tool interactions specific to GaAs and InP materials systems.
• Experience with facility system design reviews, tool hookup requirements, risk assessments, and startup or commissioning activities.
• Familiarity with SPC, FDC, CMMS, reliability engineering methods, and data-driven maintenance strategies.
• Experience managing capital equipment improvement projects, vendor qualifications, and spare parts optimization.
• Demonstrated leadership in mentoring technical teams and influencing across operations, engineering, and facilities organizations.

Work Environment

This position operates in a semiconductor manufacturing environment and may require work in cleanrooms, sub-fab areas, mechanical spaces, and utility support areas. The role may involve standing for extended periods, using personal protective equipment, and participating in tool or facility recovery efforts during critical events, installations, or shutdowns.

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)
• Restricted Stock Units