NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.

NVIDIA is looking for a Thermal Engineer to lead thermal invent and evaluation for next-generation photonic built circuits and built optical modules (CPO) platforms. In this position, you will address sophisticated electro-thermal and multi-physics problems at the chip, package, and system scales, supporting high-density, high-performance optical-electrical integration. You will collaborate with teams in photonics, electrical IC, packaging, and reliability. You will build and deliver robust thermal solutions that support NVIDIA’s future AI and advanced computational infrastructure.

What you'll be doing:

• Engineer, construct, and optimize thermal solutions for silicon photonics and co-packaged optics systems, involving closely aligned optical engines and ASICs

• Develop and examine comprehensive thermal models using Cadence Celsius Thermal Solver, investigating temperature-dependent characteristics of photonic devices (e.g., modulators, waveguides, wavelength stability)

• Drive thermal co-design and optimization of co-packaged architectures, including heat sinks, cold plates, and thermal interface materials (TIMs)

• Model and simulate heat transfer and airflow using advanced CFD tools (air and liquid cooling) to enable scalable, high-efficiency cooling solutions

• Lead simulation-to-silicon correlation, contributing to experimental validation, thermal characterization, and root-cause analysis

• Define and influence thermal build methodologies and guidelines for next-generation optical interconnect and high-performance computing systems

What we need to see:

• PhD in Mechanical Engineering or a related field (or equivalent experience) with 4+ years of proven experience in thermal or mechanical engineering

• Deep expertise in:

  • Cadence Celsius Thermal Solver

  • CFD tools such as Ansys Fluent, Icepak, or equivalent

  • Coupled electro-thermal simulation and analysis

  • Thermo-mechanical stress (ANSYS) and reliability analysis

• Strong fundamentals in heat transfer, thermodynamics, and proven mechanics.

• Proficiency in Python or MATLAB for modeling, automation, and data analysis.

• Proven track record to collaborate efficiently in fast-paced, multi-functional engineering teams.

• Experience with silicon photonics, optical interconnects, or datacenter hardware would be considered a plus.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 264,500 USD for Level 4, and 196,000 USD - 310,500 USD for Level 5.

Applications for this job will be accepted at least until July 12, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.