This role is based in Bangalore, India

Role Overview

We are seeking an experienced and dynamic Engineering Leader in Semiconductor Hardware Development to drive the design, development, and delivery of advanced process equipment. The ideal candidate will bring deep technical expertise in Electrochemical Plating (ECP) equipment and/or wet cleaning systems, along with proven leadership in scaling high-performance engineering teams.

Experience

• Minimum 15+ years of experience in semiconductor equipment/hardware engineering
• Strong track record of leading complex system design and development programs in high-volume manufacturing environments
• Strong track record of delivering full tool platforms or critical modules into HVM (High Volume Manufacturing)
• Experience leading multi-disciplinary engineering teams (mechanical, fluidics, process, electrical, controls)
• Proven ability to build and manage high-performing, cross-functional engineering teams

Core Technical Expertise

• Deep hands-on experience in vacuum system design (mandatory), including chamber architecture, gas delivery, pumping systems, and contamination control
• Strong expertise in Electrochemical Plating (ECP) systems:
• Design and optimization of plating chambers, fluid delivery systems, and current distribution architectures
• Understanding of wafer-level deposition uniformity, defect control, and process integration
• Experience with electrolyte chemistry management, filtration, and recirculation systems

Extensive experience in wet processing / wet cleaning equipment:

• Design of single-wafer and batch cleaning systems, including chemical dispense, rinse/dry modules, and fluid handling systems
• Knowledge of surface preparation, contamination removal, and defectivity reduction techniques
• Familiarity with materials compatibility, corrosion control, and chemical safety considerations
• Demonstrated ownership of module-level or full system design, including mechanical, fluidic, thermal, and process integration aspects
• Strong problem-solving capability in highly complex, failure-sensitive environments, including root cause analysis and reliability engineering

System Engineering & Integration

• Experience in end-to-end equipment design, from concept architecture to qualification and production release
• Expertise in multi-physics system interactions (fluidics, electrochemistry, thermals, and vacuum environments)
• Exposure to process-tool interactions, including yield improvement, defectivity control, and throughput optimization

Global Exposure

• Experience working with North American semiconductor OEMs or technology organizations
• Proven success in cross-regional collaboration, including onsite engagements and global program execution

Innovation & Thought Leadership

• Strong technical credibility demonstrated through:
• Patents in semiconductor equipment, ECP, or wet processing domains
• Conference publications (e.g., SEMI, IEEE, ECS) or equivalent industry contributions
• Ability to drive innovation in process equipment design, focusing on yield, reliability, and cost of ownership

Leadership & Communication

• Excellent communication skills with the ability to:
• Translate complex technical concepts to executive stakeholders
• Drive alignment across global engineering, process, and manufacturing teams
• Proven leadership in mentoring senior engineers and fostering technical depth within teams

Work Flexibility

Willingness to collaborate across North America time zones in a globally distributed development environment

This role is based in Bangalore - India