About the role

Qualcomm's Cloud Business Unit is building next-generation AI inference rack scale solutions, anchored by the AI200/AI250 accelerator family. We are seeking a seasoned Senior Director to lead the end-to-end hardware architecture, design, and delivery of full rack-level solutions — from OCP/Open Rack-compliant chassis, power, and thermal systems to high-speed interconnects, management infrastructure, and ODM engagement. This leader will define Qualcomm's rack-scale differentiation strategy and drive execution across cross-functional hardware and systems teams.

Key Responsibilities

Rack Architecture & System Design

• Define and own end-to-end rack-scale architecture for Qualcomm AI accelerator platforms (AI200/AI250 family and future roadmap), targeting OCP Open Rack and 19" EIA form factors.
• Lead system-level design trade-offs spanning power delivery (48V DC busbar, rack PDU), cooling architecture, signal integrity, and mechanical integration.

Thermal & Cooling Systems

• Architect and oversee direct liquid cooling (DLC) systems including CDU sizing (e.g., 138+ kW per rack), blind-mate manifolds (UQD/UQDB), cold plates, leak detection, and coolant loop design.
• Ensure rack-level thermal validation and compliance with customer facility requirements (CDU inlet temperature, flow rate, pressure drop).

Power Architecture

• Define rack power delivery architectures including 48V DC busbars, modular PSU shelves and VR/PMIC integration.
• Drive power budget analysis across full rack configurations (compute blades, switches, storage, CDU) and ensure PUE/efficiency targets are met.

High-Speed Interconnects & Networking

• Lead rack-scale interconnect strategy encompassing CXL, UALink, PCIe Gen 6, and 800G/1.6T Ethernet switching fabrics (scale-up and scale-out).
• Own signal integrity requirements for high-performance PCB materials and rack-level cabling (copper and optical), including material trade-off analysis.

BMC / RMC & Rack Management

• Define and drive BMC/RMC architecture for OOB management, Redfish/IPMI compliance, telemetry, and health monitoring.
• Ensure DC-SCM 2.0 integration and multi-generation firmware roadmap aligned with OCP standards.

ODM & Ecosystem Engagement

• Lead technical engagement with ODM/OEM partners for rack-level NRE, design validation, manufacturing, and qualification.
• Partner with hyperscaler customers and CSPs to align rack-scale hardware solutions to datacenter facility and operational requirements.

Cross-Functional Leadership & Execution

• Build, mentor, and lead a high-performance team of rack-scale hardware, thermal, power, and mechanical engineers across multiple sites.
• Partner with ASIC, software, product management, and supply chain teams to drive rack-level productization milestones from concept to NPI.
• Own rack-level hardware validation and EVT/DVT/PVT planning, coordinating with QA and customer enablement teams.
• Manage rack-scale program budgets, headcount planning, and delivery schedules in alignment with Cloud BU product roadmap.

Experience

• 20+ years of experience in hardware engineering, with at least 5 years in a senior leadership role (Director or above).
• Proven track record of delivering rack-scale or full-system hardware platforms for cloud/data center markets.
• Deep expertise in OCP Open Rack v3 (ORv3) standards, OCP DC-MHS, DC-SCM, and related specifications.
• Hands-on experience with direct liquid cooling (DLC) system design and thermal architecture at the rack level.
• Strong background in high-speed digital design (PCIe Gen5/6, CXL, UALink, Ethernet 400G/800G) and signal integrity.
• Experience with rack-level power architecture including 48V DC distribution, VR/PMIC design, and efficiency optimization.
• Familiarity with BMC/RMC platforms, Redfish API, IPMI, and OCP management stack.
• Experience managing ODM/OEM partnerships for large-scale hardware development and qualifications.

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