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      Low Power Design Engineer Interview

      Apr 19, 2017
      Anonymous Interview Candidate
      Austin, TX
      No offer
      Neutral experience
      Average interview

      Application

      I applied online. I interviewed at Qualcomm (Austin, TX)

      Interview

      1 Phone call, followed by onsite interview. Interview process is time consuming, questions are fairly simple and basic and associates are not responsive to emails and no refund provided for travel yet. Good luck!

      Interview questions [1]

      Question 1

      Phone interview: Questions based on resume, followed by low power design questions: 1. How can you reduce power on chip? 2. Dynamic Power, Leakage power? 3. Types of circuits required to implement low power design-level shifters/isolations cells etc. 4.Questions on In rush current. Onsite interview: 1-1 interviews each 1 hour long from 9:30am -5:00pm Initially, questions on the resume. 1. Basic Computer Architecture questions. 2. IR Drop reduction on chip using Redhawk 3. Setup and hold time issues and solutions. 4. Primetime timing report interpretation 5. Steps in Design compiler, primetime, ICC, Redhawk 6. Low power design questions and how to implement low power design. 7. Ways to reduce dynamic and leakage power. 8. Basic scripting questions on TCL. 9. Mosfet operation and diagram of the different types of leakage currents. 10. Everything on the resume in detail and job description dependent questions.
      Answer question
      13

      Qualcomm interviews FAQs

      • Common stages of the interview process at Qualcomm as a Low Power Design Engineer according to 1 Glassdoor interviews include:

        Group panel interview:  50%

        Phone interview:  50%

      • Here are the most commonly searched roles for interview reports -

        1. Software Engineer(976) ;
        2. Senior Engineer(826) ;
        3. Engineer(811) ;
        4. Staff Engineer(622) ;
        5. Senior Software Engineer(544) ;
        6. Senior Staff Engineer(242) ;
        7. Senior Lead Engineer(206) ;
        8. Intern(176) ;
        9. Associate Engineer(137) ;
        10. Staff Software Engineer(134) ;
        11. Interim Engineering Intern(124) ;
        12. Hardware Engineer(116) ;
        13. Systems Engineer(75) ;
        14. Senior Hardware Engineer(68) ;
        15. Software Engineer(Internship)(65) .


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