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Our team in Tualatin, Oregon, was hard at work developing the industry’s latest deposition tool designed for advanced packaging: VECTOR® TEOS 3D. Discover how this breakthrough came to life — and meet the experts behind its development.
Inside TEOS 3D Manufacturing at Lam Tualatin
As logic devices shrink, voltage loss grows. Our Semiverse® Solutions team put two backside power delivery architectures, direct backside contact (DBC) and self-aligned backside contact (SABC), to the test in a virtual study. The result: SABC shows stronger tolerance to manufacturing variation and a larger process window for advanced gate-all-around (GAA) nodes. Get the full breakdown in the blog post.
Minimizing Voltage Loss and Improving Yield in Advanced GAA Chips
As chips grow more complex, tools like our Fabtex™ Yield Optimizer platform become indispensable. Learn how the combination of AI, ML, and physics-based virtualization helps chipmakers drive innovation, sustainability, and competitive advantage in the semiconductor industry.
How AI and Virtual Twins Can Supercharge Semiconductor Yield - EE Times
What do customers get when they leverage virtualization? ➡️ They waste fewer wafers and materials, get faster answers, and gain broader access. Learn how Semiverse® Solutions makes it possible.
Using Semiverse® Solutions for virtualization
Our researchers reveal the vision behind Mo-based metallization and how it’s driving the future of semiconductor fabrication in a recent paper. Take a look.
Lam Researchers Spotlight Breakthrough in Hybrid Metallization
"Top Supplier for 2025" has a nice ring to it! Honored to be recognized by Micron for our commitment to high-quality performance and innovation. Read more.
Lam Earns 2025 Micron Top Supplier Award
Lam accelerates the next phase of semiconductor innovation with atomic-scale advances in etch and packaging, plus AI tools like Fabtex™ Yield Optimizer that sharpen speed and precision in HVM. At SEMICON West 2025, SVP & GM Sesha Varadarajan emphasized that progress also depends on collaboration and developing the talent to support this new era. Read more via Semiconductor Digest.
AI in Every Layer
In this edition of Semi 101, we examine the latest advanced techniques enabling the future of computing. Take a look. ⬇️
Advanced Packaging Techniques (Semi 101)
Innovation has deep roots in Oregon. Our new “Building G” in Tualatin expands our capacity to engineer the most advanced technology. It’s more than a new facility; it’s an investment in the people, tools, and ideas that keep the Silicon Forest thriving. Explore more via the blog.
Lam Is Committed to Growing the Silicon Forest
Precision meets complexity. Our Kiyo® etch technology keeps high-bow wafers on glass carriers flat, cool, and consistent, giving chipmakers the control they need to scale advanced packaging and heterogeneous integration. Tap the link to learn more.
Lam Researchers Spotlight Etch Breakthrough for Advanced Packaging