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What happens when 3D NAND layers stretch too far? We used SEMulator3D® to simulate stress-induced tier collapse — revealing how material properties like Young’s modulus can make or break device integrity. Read the full analysis.
SEMulator3D® Sheds Light on Tier Bending in 3D NAND Flash Memory
Why molybdenum? Corporate VP & GM Dr. Kaihan Ashtiani joins Semiconductor Insiders to discuss the material and process innovations shaping next-gen devices. Listen now.
Podcast EP300: Next Generation Metalization Innovations with Lam's Kaihan Ashtiani
With Akara®, our customers achieve results once thought impossible. Learn how Akara® makes the next generation of advanced logic and memory technologies possible.
Akara: Enabling Revolutionary Advanced Logic and Memory Technologies (Made by Lam)
What makes an AI model useful in the fab? Corporate VP David Fried shares how we accelerate the development of AI-based equipment models using data and how these models guide real-world tool optimization via Semiconductor Engineering.
AI In The IC Equipment Ecosystem
Building chips for AI means solving complex challenges — building new materials and ultra-precise manufacturing steps. Using molybdenum, we improve conductivity while simplifying the metallization process. Learn more.
AI is Boosting Semiconductor Manufacturing - EE Times
Senior Vice President, Chief Technology and Sustainability Officer Vahid Vahedi breaks down how we design semiconductor solutions with lower energy use, fewer emissions, and smarter virtual processes that reduce waste at every step. It’s not just about checking the box — it’s about creating tools and technologies that help our customers meet their goals. See how our teams engineer practical solutions for a more sustainable future via the blog.
Designing a Sustainable Future for Semiconductors
Did you know our state-of-the-art dry patterning solutions enable logic and DRAM scaling at the lowest cost by extending single-print EUV lithography to more advanced nodes? See how we tackle challenges associated with advanced patterning, such as edge placement errors, via the blog.
How Advanced Patterning Enables Smarter, Smaller Chips (Semi 101)
Did you know that switching from tungsten to molybdenum in chip interconnects can reduce contact resistance by up to 50%? In this Semiconductor Engineering article, Corporate VP & GM Dr. Kaihan Ashtiani explains how this shift improves performance and reliability for AI chips operating at extreme scales.
Power Delivery Challenges For AI Chips
With Semiverse® Solutions, engineers can virtually visualize complicated 3D structures like never before. Read our blog post to see how virtual fabrication transforms semiconductor development.
Embracing Semiverse® Solutions: Semiconductor Virtual Fabrication and Its Applications
Our collaborative robot Dextro™, a historic first in the semiconductor industry, won a Best of Sensors Award! We let Dextro™ shed light on this achievement in a recent blog post. Check it out.
First of Its Kind: Dextro Cobot Wins Best of Sensors Award for Revolutionizing Fab Maintenance