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Introduced in 2020, Aether® is key to the production of next-generation semiconductor devices. Learn how we partner with industry leaders to deliver precise, low-defect DRAM patterning innovations at scale via the release.
Breakthrough EUV Dry Photoresist Technology from Lam Research Adopted by Leading Memory Manufacturer
Once again, we landed on the Dow Jones Sustainability Index for North America! This continued recognition highlights our leadership in sustainability and reflects how we’re integrating sustainability principles in our policies, processes, and products. As part of our dedication to sustainability, we also joined Climate Group’s RE100. Explore how we prioritize sustainability at Lam.
Lam Research Continues Sustainability Momentum With DJSI Recognition and RE100 Membership
Next-generation device roadmaps demand direct-print 28nm pitch BEOL to enable scaling. Explore how our dry photoresist (dry resist) technology optimizes patterning by overcoming the well-known tradeoff between EUV exposure dose (cost) and defectivity (yield).
Lam Research Establishes 28nm Pitch in High-Resolution Patterning Through Dry Photoresist Technology
Diversity and inclusion fuel everything we do, and we’re thrilled to be recognized with the Human Rights Campaign Foundation’s 2025 Equality 100 Award — the highest possible rating for workplace equality. Explore more.
Keepin' It 100 on the Corporate Equality Index
As part of our mission to reach net zero by 2050, we always seek sustainable alternatives to current R&D practices. Discover why virtual twins may be the answer despite their high energy requirements.
Is Virtualization Greener Than Lab Work for Chips?
Did you know virtual twins can achieve the same results as physical tests but with far less carbon emissions? Find out how virtual twins and sustainability go hand in hand.
Less Waste, Faster Results: Why Virtual Twins Are Critical to Future Semiconductor R&D
When we collaborate with universities, the possibilities are endless. Through our University Research programs, Lam engineers team up with faculty and students to collaboratively work on Lam-funded research projects in areas such as on-wafer materials and interfaces, plasma characterization and control, and increasing productivity and sustainability. Read the blog for more.
Accelerating Innovation with University Research
The fab of the future is here. Dextro™, our first collaborative robot (cobot) for semiconductor manufacturing, works alongside chipmakers to optimize precision, efficiency, cost, and repeatability in tool maintenance. Explore this groundbreaking technology. https://www.lamresearch.com/product/dextro/
Building the Fabs of Tomorrow - Leading the Way With Autonomous Capabilities
The future of semiconductor fab maintenance is here. Introducing Dextro™, our new collaborative robot (cobot) driving efficiency in wafer fab equipment maintenance. Read the blog to find out how Dextro™ helps chipmakers save time, reduce costs, and improve yield.
Cobots Lend a Much-Needed Hand for Error-Prone, Challenging Maintenance Tasks
In a recent study, we explore process parameters and corresponding process windows needed to deliver interconnect performance at 2nm and beyond. Here’s what we found. https://bit.ly/3CIBOhD
Optimizing New Interconnect Technologies to Support Next Generation Semiconductor Devices