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What does faster, more efficient technology look like? It looks like Lam Cryo™ 3.0, a winner of the 2025 Edison Gold Award! Our blog post dives into the details.
Lam Cryo 3.0 Receives Gold Award for 'Game-Changing' Etch Innovation
As demand for advanced packaging increases, new substrate materials and process innovations are essential for achieving the interconnect density required for AI, high-performance computing, and 5G applications. Managing Director for Advanced Packaging Chee Ping Lee explores these shifts in a Semiconductor Engineering article.
Big Changes Ahead For Interposers And Substrates
NF3 has a high global warming potential, but smart optimizations can make a difference. By working with STMicroelectronics, we achieved a 32% reduction in CO2e emissions through optimized chamber cleaning — a step toward a more sustainable future. Learn more.
Chamber Cleaning Optimizations Can Reduce Carbon Emissions by 32%
For the third year in a row, we’re joining the 136 companies named one of the World's Most Ethical Companies® by Ethisphere. This recognition honors our commitment to advancing business integrity through ethics and compliance, governance, culture, environmental and social impact, and more.
Lam Research Named One of the World's Most Ethical Companies® for the Third Consecutive Year
Can Dual Work-Function Metal Gate (DWMG) structure in DRAM buried word-lines mitigate gate-induced drain leakage? Dive into our latest blog post to see how we leveraged SEMulator3D® to show how this approach reduces leakage current while maintaining device performance.
Improving DRAM Performance Using Dual Work-Function Metal Gate (DWMG) Structures
Built on the legacy of our Kiyo® solution, Akara® represents the next generation of our conductor etch innovation and leadership. Read the blog to learn everything about this breakthrough.
Everything You Need to Know About Akara®
We unveiled the industry's most advanced conductor etch solution to date — Akara®. Akara® helps chipmakers overcome the toughest scaling challenges associated with complex 3D architectures. Learn how our technology leverages new proprietary etch solutions to tackle these issues.
Lam Research Unveils Industry's Most Advanced Conductor Etch Technology to Date
The future of NAND, DRAM, and logic devices depends on advanced deposition tools like our newest solution ALTUS® Halo — the world’s first atomic layer deposition (ALD) tool leveraging the metal molybdenum. Learn how we help customers produce the next generation of cutting-edge semiconductor chips.
Lam Research Ushers in New Era of Semiconductor Metallization with ALTUS® Halo for Molybdenum Atomic Layer Deposition
Shrinking transistors to the angstrom scale presents major patterning challenges. Our Aether® dry resist technology, used with EUV (extreme ultraviolet) lithography, overcomes these hurdles, enabling higher resolution and optimized yields for next-gen semiconductors.
Everything You Need to Know About Aether®
Fortune named us one of the World’s Most Admired Companies for 2025! This recognition is a testament to our ongoing dedication to excellence, innovation, and collaboration. See how we earned a spot on the list.
Lam Research Again Named One of Fortune's World's Most Admired Companies